When
Ready for a hands-on summer in semiconductor research?
6-week immersive Research Experience for Undergraduates (REU) from June 1- July 15 focused on advanced semiconductor packaging and heterogeneous integration. Work inside ASU’s Nanofab and MacroTechnology Works (MTW) facilities while engaging with industry leaders including INtel and Deca Technologies.
What are the benefits?
- $4,000 Student Stipend
- On-Campus Housing
- Hands-on cleanroom & packaging lab access
- Industry site visits (including Intel)
- Faculty & graduate student mentorship
- Professional networking opportunities
Who is eligible?
- Undergraduate students in Engineering, Physics, or related STEM disciplines. Students from ASU, University of Arizona, NAU, and Maricopa Community Colleges are encouraged to apply
Need help with your application? The Undergraduate Research Ambassador team is here to support you on every step of your research journey! Please reach out to the Undergraduate Research Ambassadors by sending your inquiries to their email at undergradresearch@arizona.edu(link sends e-mail)(link sends e-mail) or scheduling a 1:1 appointment with them.
Ready to submit? Submit here. The application deadline is Friday, April 10, 2025, at 11:59 PM AZ Time.
Questions? Please email your inquiries to Snow Piel at TUYET-TRANG.LAM@asu.edu